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Comparative analysis of mechanical strength of diamond-sawn silicon wafers depending on saw mark orientation, crystalline nature and thickness

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Submitted on : Monday, October 25, 2021 - 4:23:52 PM
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Louise Carton, Roland Riva, Fabrice Coustier, Amal Chabli, Daniel Nelias, et al.. Comparative analysis of mechanical strength of diamond-sawn silicon wafers depending on saw mark orientation, crystalline nature and thickness. Solar Energy Materials and Solar Cells, Elsevier, 2019, 201, pp.110068. ⟨10.1016/j.solmat.2019.110068⟩. ⟨hal-03336859⟩

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